Technical parameters/number of pins: 144
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.2 V
Technical parameters/power supply voltage (Max): 1.26 V
Technical parameters/power supply voltage (Min): 1.14 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: CABGA-144
External dimensions/length: 10 mm
External dimensions/width: 10 mm
External dimensions/height: 1.4 mm
External dimensions/packaging: CABGA-144
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: PCI To PCI Bridge
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TSI382-66IL
|
Integrated Device Technology | 功能相似 | LFBGA-144 |
Ic Pci-X1 Pci Expr Bridge 144bga
|
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