Technical parameters/power supply voltage: 1.2 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: LFBGA-144
External dimensions/length: 10.0 mm
External dimensions/width: 10.0 mm
External dimensions/packaging: LFBGA-144
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: PCI To PCI Bridge
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TSI382-66ILV
|
Integrated Device Technology | 功能相似 | CABGA-144 |
接口桥接器, PCI Express至PCI, 1.14 V, 1.26 V, PBGA, 144 引脚, -40 °C
|
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|
|
Renesas Electronics | 功能相似 |
接口桥接器, PCI Express至PCI, 1.14 V, 1.26 V, PBGA, 144 引脚, -40 °C
|
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