Technical parameters/capacitors: 3 pF
Technical parameters/rated power: 800 mW
Technical parameters/output voltage: 350 V
Technical parameters/output current: ≤120 mA
Technical parameters/contact type: SPST-NO
Technical parameters/number of circuits: 2
Technical parameters/load current: 120 mA
Technical parameters/input current: 6 mA
Technical parameters/dissipated power: 800 mW
Technical parameters/isolation voltage: 3750 v
Technical parameters/input voltage: 1.4 V
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: DIP-8
External dimensions/length: 9.65 mm
External dimensions/width: 8.07 mm
External dimensions/height: 3.30 mm
External dimensions/packaging: DIP-8
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TS122
|
IXYS Semiconductor | 类似代替 | DIP-8 |
固态继电器-PCB安装 350V 170mA Integrated
|
||
XS170
|
IXYS Semiconductor | 类似代替 | DIP-8 |
固态继电器-PCB安装 350V 120mA Integrated
|
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