SFC-120-T2-L-D-A-TR In Stock|PDF|Datasheet|Price|Agent[SFC-120-T2-L-D-A-TR Alternative|Silk Screen|Technology|Solution Development]-ICGOODFIND

Warm reminder: The pictures are for reference only. The actual product may vary

Model SFC-120-T2-L-D-A-TR

Description SAMTEC SFC-120-T2-L-D-A-TR Board-To-Board Connector, 1.27mm, 40Contacts, Receptacle, SFC Series, Surface Mount, 2Rows

Brand: Samtec

Packaging Surface Mount

Delivery time

Packaging method Tape & Reel (TR)

Standard packaging quantity 1

Freight charges： In stock Freight rate：$13.00

Quantity：

Inventory(5272) Minimum order quantity(1)

Add to Cart Buy now

Welcome to use ICGOODFIND AI Assistant

Chip AI consultant

Download related files

PDF

Specification parameters
PDF
Silk screen printing
Review and share the purchase （0 ）
Product inquiry (0)
Selection Manual
Adapter model (0)

Technical parameters/number of contacts:	40
Technical parameters/polarity:	Female
Technical parameters/Contact electroplating:	Gold
Technical parameters/rated current:	3.1A/contact
Technical parameters/number of rows:	2
Technical parameters/number of pins:	40
Technical parameters/rated voltage:	350 VAC
Encapsulation parameters/installation method:	Surface Mount
Physical parameters/contact material:	Phosphor Bronze
Physical parameters/operating temperature:	-55℃ ~ 125℃
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Tape & Reel (TR)
Other/Manufacturing Applications:	-
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free
Compliant with the REACH SVHC standard:	No SVHC
Compliant with standard/REACH SVHC version:	2015/06/15

Alternative material

	Model	Brand	Similarity	Encapsulation	Introduction	Data manual
	5-104652-4	TE Connectivity	功能相似		TE connectivity AMPMODU 50/50 1.27mm x 1.27mm 栅格板对板垂直插座 AMPMODU 50/50 1.27mm x 1.27mm 栅格板对板垂直插座，用于高密度 .050 x .050 应用中的 SMT 平行板对板堆叠。平行板对板堆叠高度为 6.35mm，可通过使用相同插座和选择合适的管座（板对板 .050 x.050 双排垂直和直角管座）来达到 8.13mm 和 9.91mm。这些 AMPMODU 50/50 1.27mm x 1.27mm 垂直 SMT 板对板插座连接器具有 UL 94V-0 黑色玻璃填充热塑性外壳、印刷电路板压制接线柱、极化插片、镀金触点且与 IR（红外）和 VPR（汽相回流）表面安装工艺兼容。 ### 认可 UL 94V-0 ### TE Connectivity AMPMODU 50/50 1.27mm 连接器 TE Connectivity Modu 50/50 是高密度 1.27mm 栅格电路板到电路板连接系统，用于 SMT 装配。印刷电路板管座的三个不同高度的选择允许获得多用途堆叠解决方案。	PDF
	5-104652-4	Tyco Electronics	功能相似		TE connectivity AMPMODU 50/50 1.27mm x 1.27mm 栅格板对板垂直插座 AMPMODU 50/50 1.27mm x 1.27mm 栅格板对板垂直插座，用于高密度 .050 x .050 应用中的 SMT 平行板对板堆叠。平行板对板堆叠高度为 6.35mm，可通过使用相同插座和选择合适的管座（板对板 .050 x.050 双排垂直和直角管座）来达到 8.13mm 和 9.91mm。这些 AMPMODU 50/50 1.27mm x 1.27mm 垂直 SMT 板对板插座连接器具有 UL 94V-0 黑色玻璃填充热塑性外壳、印刷电路板压制接线柱、极化插片、镀金触点且与 IR（红外）和 VPR（汽相回流）表面安装工艺兼容。 ### 认可 UL 94V-0 ### TE Connectivity AMPMODU 50/50 1.27mm 连接器 TE Connectivity Modu 50/50 是高密度 1.27mm 栅格电路板到电路板连接系统，用于 SMT 装配。印刷电路板管座的三个不同高度的选择允许获得多用途堆叠解决方案。