5-104652-4 In Stock|PDF|Datasheet|Price|Agent[5-104652-4 Alternative|Silk Screen|Technology|Solution Development]-ICGOODFIND

Warm reminder: The pictures are for reference only. The actual product may vary

Model 5-104652-4

Description TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid board to board vertical socket AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical socket, used for SMT parallel board to board stacking in high-density. 050 x. 050 applications. The parallel board to board stacking height is 6.35mm, which can be achieved by using the same socket and selecting suitable sockets (board to board. 050 x.050 double row vertical and right angle sockets) to achieve 8.13mm and 9.91mm. These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board socket connectors have UL 94V-0 black glass filled thermoplastic housing, printed circuit board pressed terminal posts, polarized inserts, gold-plated contacts, and are compatible with IR (infrared) and VPR (vapor phase reflow) surface mounting processes. ###Recognized UL 94V-0 # # # TE Connectivity AMPMODU 50/50 1.27mm connector TE Connectivity Modu 50/50 is a high-density 1.27mm grid circuit board to circuit board connection system used for SMT assembly. The selection of three different heights for printed circuit board sockets allows for a versatile stacking solution.

Brand: TE Connectivity

Packaging

Delivery time

Packaging method Tube

Standard packaging quantity 1

1+:

$ 37.0978

10+:

$ 34.9692

100+:

$ 33.3880

250+:

$ 33.1447

500+:

$ 32.9015

1000+:

$ 32.6278

2500+:

$ 32.3845

5000+:

$ 32.2325

Price	$ 37.0978	$ 34.9692	$ 33.3880	$ 33.1447	$ 32.9015
Start batch production	1+	10+	100+	250+	500+

Freight charges： In stock Freight rate：$13.00

Quantity：

Inventory(4438) Minimum order quantity(1)

Add to Cart Buy now

Welcome to use ICGOODFIND AI Assistant

Chip AI consultant

Download related files

PDF

Specification parameters
PDF
Silk screen printing
Review and share the purchase （0 ）
Product inquiry (0)
Selection Manual
Adapter model (0)

Technical parameters/number of contacts: 40

Technical parameters/polarity: Female

Technical parameters/Contact electroplating: Gold, Tin over Nickel

Technical parameters/rated voltage (AC): 30.0 V

Technical parameters/rated current: 4 A

Technical parameters/insulation resistance: 5000 MΩ

Technical parameters/number of rows: 2

Technical parameters/direction: Vertical

Technical parameters/Flammability level: UL 94 V-0

Technical parameters/number of pins: 40

Technical parameters/rated current (Max): 4A/contact

Technical parameters/operating temperature (Max): 105 ℃

Technical parameters/operating temperature (Min): -65 ℃

Technical parameters/rated voltage (Max): 30 VAC

Technical parameters/rated voltage: 30 VAC

Technical parameters/Contact resistance (Max): 16 mΩ

Encapsulation parameters/installation method: Surface Mount

Packaging parameters/pin spacing: 1.27 mm

External dimensions/length: 25.8 mm

External dimensions/width: 3.05 mm

External dimensions/height: 4.75 mm

External dimensions/pin spacing: 1.27 mm

Physical parameters/shell color: Black

Physical parameters/color: Black

Physical parameters/contact material: Copper Alloy

Physical parameters/operating temperature: -65℃ ~ 105℃

Physical parameters/shell material: Thermoplastic

Other/Product Lifecycle: Active

Other/Packaging Methods: Tube

Other/Manufacturing Applications: Industrial, Industrial-

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standards/ELV standards: Compliant

Compliant with standards/REACH SVHC standards: No SVHC

Customs information/ECCN code: EAR99

Customs information/HTS code: 8536694040

Alternative material

Model	Brand	Similarity	Encapsulation	Introduction	Data manual
104652-4	TE Connectivity	功能相似	Surface Mount	板对板与夹层连接器 50/50 RECEPTACLE	PDF
5-104652-4	TE Connectivity	功能相似		TE connectivity AMPMODU 50/50 1.27mm x 1.27mm 栅格板对板垂直插座 AMPMODU 50/50 1.27mm x 1.27mm 栅格板对板垂直插座，用于高密度 .050 x .050 应用中的 SMT 平行板对板堆叠。平行板对板堆叠高度为 6.35mm，可通过使用相同插座和选择合适的管座（板对板 .050 x.050 双排垂直和直角管座）来达到 8.13mm 和 9.91mm。这些 AMPMODU 50/50 1.27mm x 1.27mm 垂直 SMT 板对板插座连接器具有 UL 94V-0 黑色玻璃填充热塑性外壳、印刷电路板压制接线柱、极化插片、镀金触点且与 IR（红外）和 VPR（汽相回流）表面安装工艺兼容。 ### 认可 UL 94V-0 ### TE Connectivity AMPMODU 50/50 1.27mm 连接器 TE Connectivity Modu 50/50 是高密度 1.27mm 栅格电路板到电路板连接系统，用于 SMT 装配。印刷电路板管座的三个不同高度的选择允许获得多用途堆叠解决方案。	PDF
5-104652-4	Tyco Electronics	功能相似		TE connectivity AMPMODU 50/50 1.27mm x 1.27mm 栅格板对板垂直插座 AMPMODU 50/50 1.27mm x 1.27mm 栅格板对板垂直插座，用于高密度 .050 x .050 应用中的 SMT 平行板对板堆叠。平行板对板堆叠高度为 6.35mm，可通过使用相同插座和选择合适的管座（板对板 .050 x.050 双排垂直和直角管座）来达到 8.13mm 和 9.91mm。这些 AMPMODU 50/50 1.27mm x 1.27mm 垂直 SMT 板对板插座连接器具有 UL 94V-0 黑色玻璃填充热塑性外壳、印刷电路板压制接线柱、极化插片、镀金触点且与 IR（红外）和 VPR（汽相回流）表面安装工艺兼容。 ### 认可 UL 94V-0 ### TE Connectivity AMPMODU 50/50 1.27mm 连接器 TE Connectivity Modu 50/50 是高密度 1.27mm 栅格电路板到电路板连接系统，用于 SMT 装配。印刷电路板管座的三个不同高度的选择允许获得多用途堆叠解决方案。
SFM-120-02-S-D-A	Samtec	功能相似	Surface Mount	SAMTEC SFM-120-02-S-D-A 线至板连接器, SFM系列, 40 触点, 插座, 1.27 mm, 表面安装 , 2 排	PDF