Technical parameters/minimum current amplification factor (hFE): | 80 |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 6 |
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Encapsulation parameters/Encapsulation: | UMT |
|
Dimensions/Length: | 2.2 mm |
|
Dimensions/Width: | 1.35 mm |
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Dimensions/Height: | 1 mm |
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Dimensions/Packaging: | UMT |
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Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PUMB2,115
|
NXP | 功能相似 | TSSOP-363 |
NXP PUMB2,115 晶体管 双极预偏置/数字, BRT, -50 V, -100 mA, 47 kohm, 47 kohm, 1 电阻比率, SOT-363
|
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