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Description 1A Up to 1.5A, NXP Semiconductors' efficient ultra small and thin surface mount packaging has been optimized for low forward voltage drop, high junction temperature, and negligible power switching loss with low leakage current in diodes and rectifiers. NXP Semiconductors NXP offers a wide range of switching diodes in different packages and configurations.
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Brand: NXP
Packaging SOD-323
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
0.54  yuan 0.54yuan
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(2255) Minimum order quantity(1)
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Technical parameters/Maximum forward surge current (Ifsm):

9 A

 

Technical parameters/forward current (Max):

1 A

 

Technical parameters/operating temperature (Max):

150 ℃

 

Technical parameters/operating temperature (Min):

-65 ℃

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

2

 

Encapsulation parameters/Encapsulation:

SOD-323

 

Dimensions/Length:

1.8 mm

 

Dimensions/Width:

1.35 mm

 

Dimensions/Height:

0.8 mm

 

Dimensions/Packaging:

SOD-323

 

Other/Product Lifecycle:

Unknown

 

Other/Packaging Methods:

Tape & Reel (TR)

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

Lead Free

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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