Technical parameters/forward voltage: | 360mV @1A |
|
Technical parameters/thermal resistance: | 18℃/W (RθJL) |
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Technical parameters/Maximum forward surge current (Ifsm): | 50 A |
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Technical parameters/forward voltage (Max): | 360mV @1A |
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Technical parameters/operating temperature: | 150℃ (Max) |
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Technical parameters/dissipated power (Max): | 570 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 2 |
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Encapsulation parameters/Encapsulation: | SOD-123 |
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Dimensions/Width: | 1.9 mm |
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Dimensions/Packaging: | SOD-123 |
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Physical parameters/operating temperature: | -55℃ ~ 150℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EC11FS4
|
Nihon Inter | 功能相似 |
Rectifier Diode, 1 Element, 0.76A, 400V V(RRM), Silicon, SURFACE MOUNT PACKAGE-2
|
|||
PMEG2010ER
|
Nexperia | 类似代替 | SOD-123 |
NXP PMEG2010ER 肖特基整流器, 单, 20 V, 1 A, SOD-123W, 2 引脚, 340 mV
|
||
PMEG2010ER
|
NXP | 类似代替 | SOD-123 |
NXP PMEG2010ER 肖特基整流器, 单, 20 V, 1 A, SOD-123W, 2 引脚, 340 mV
|
||
PMEG3010EJ
|
Nexperia | 功能相似 | SOD-323 |
1A 至 1.5A，NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器，NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
|
||
PMEG3010EJ
|
NXP | 功能相似 | SOD-323 |
1A 至 1.5A，NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器，NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
|
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