Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 6 |
|
Encapsulation parameters/Encapsulation: | SC-88 |
|
Dimensions/Packaging: | SC-88 |
|
Other/Product Lifecycle: | Obsolete |
|
Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BGA2715
|
NXP | 功能相似 | SOT-363 |
BGA2715 集成电路IC 带宽放大器 MMIC SOT-363 标记 B6t
|
||
BGA2715
|
Philips | 功能相似 |
BGA2715 集成电路IC 带宽放大器 MMIC SOT-363 标记 B6t
|
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