Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOT-363 |
|
Dimensions/Packaging: | SOT-363 |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BGA2715,115
|
NXP | 功能相似 | SOT-323-6 |
RF Amp Chip Single GP 6V 6Pin TSSOP T/R
|
||
|
|
Philips | 功能相似 | SC-88 |
RF Amp Chip Single GP 6V 6Pin TSSOP T/R
|
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