Technical parameters/operating temperature (Max): | 100 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 0.87V ~ 0.93V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 1152 |
|
Encapsulation parameters/Encapsulation: | FBGA-1152 |
|
Dimensions/Packaging: | FBGA-1152 |
|
Physical parameters/operating temperature: | -40℃ ~ 100℃ (TJ) |
|
Other/Product Lifecycle: | Last Time Buy |
|
Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 类似代替 | BGA |
FPGA Arria II GX Family 181165 Cells 500MHz 40nm Technology 0.9V 1152Pin FC-FBGA
|
||
EP2AGX190FF35C4N
|
Altera | 类似代替 | FBGA-1152 |
IC FPGA 612 I/O 11152FBGA
|
||
|
|
Intel | 完全替代 | FBGA |
FPGA Arria II GX Family 181165 Cells 500MHz 40nm Technology 0.9V 1152Pin FC-FBGA
|
||
EP2AGX190FF35C5N
|
Altera | 完全替代 | FBGA-1152 |
FPGA Arria II GX Family 181165 Cells 500MHz 40nm Technology 0.9V 1152Pin FC-FBGA
|
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