Chip AI consultant
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
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Package parameters/number of pins: | 1152 |
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Encapsulation parameters/Encapsulation: | FBGA |
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Dimensions/Packaging: | FBGA |
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Other/Product Lifecycle: | End of Life |
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Compliant with standards/RoHS standards: |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA |
FPGA Arria® II GX Family 181165 Cells 500MHz 40nm Technology 0.9V 1152Pin FC-FBGA
|
||
EP2AGX190FF35C5
|
Altera | 完全替代 | FBGA-1152 |
FPGA Arria® II GX Family 181165 Cells 500MHz 40nm Technology 0.9V 1152Pin FC-FBGA
|
||
EP2AGX190FF35C6
|
Intel | 完全替代 | BGA |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 7612 LABs 612 IOs
|
||
EP2AGX190FF35I3N
|
Altera | 完全替代 | FBGA-1152 |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 7612 LABs 612 IOs
|
||
|
|
Intel | 完全替代 | FBGA-1152 |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 7612 LABs 612 IOs
|
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