Technical parameters/dissipated power: | 839 W |
|
Technical parameters/data rate: | 150 Mbps |
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Technical parameters/input current (Min): | 20 μA |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 839 mW |
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Technical parameters/power supply voltage: | 3V ~ 3.6V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 14 |
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Encapsulation parameters/Encapsulation: | TSSOP-14 |
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Dimensions/Packaging: | TSSOP-14 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90LV019TMTC/NOPB
|
TI | 类似代替 | TSSOP-14 |
TEXAS INSTRUMENTS DS90LV019TMTC/NOPB 芯片, 驱动器/接收器, LVDS, TSSOP-14
|
||
DS90LV019TMTC/NOPB
|
National Semiconductor | 类似代替 | TSSOP-14 |
TEXAS INSTRUMENTS DS90LV019TMTC/NOPB 芯片, 驱动器/接收器, LVDS, TSSOP-14
|
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