Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-14
External dimensions/width: 4.4 mm
External dimensions/packaging: TSSOP-14
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90LV019TMTCX/NOPB
|
TI | 完全替代 | TSSOP-14 |
DS90LV019TMTCX/NOPB 编带
|
||
DS90LV019TMTCX/NOPB
|
National Semiconductor | 完全替代 | TSSOP-14 |
DS90LV019TMTCX/NOPB 编带
|
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