Technical parameters/number of pins: | 8 |
|
Technical parameters/drain source resistance: | 0.041 Ω |
|
Technical parameters/polarity: | N-Channel |
|
Technical parameters/dissipated power: | 1.9 W |
|
Technical parameters/threshold voltage: | 4.5 V |
|
Technical parameters/drain source voltage (Vds): | 150 V |
|
Technical parameters/Leakage source breakdown voltage: | 150 V |
|
Technical parameters/breakdown voltage of gate source: | ±20.0 V |
|
Technical parameters/Continuous drain current (Ids): | 6.70 A |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Technical parameters/dissipated power (Max): | 1900 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC-8 |
|
Dimensions/Length: | 5.99 mm |
|
Dimensions/Width: | 5.15 mm |
|
Dimensions/Height: | 1.04 mm |
|
Dimensions/Packaging: | SOIC-8 |
|
Physical parameters/operating temperature: | -55℃ ~ 150℃ |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standard/REACH SVHC version: | 2015/06/15 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
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SI7430DP-T1-GE3 编带
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SI7430DP-T1-GE3 编带
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SI7430DP-T1-GE3
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