Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | TSOP-6 |
|
Dimensions/Packaging: | TSOP-6 |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SI3552DV-T1-GE3
|
Vishay Semiconductor | 完全替代 | TSOP |
Trans MOSFET N/P-CH 30V 2.5A/1.8A 6Pin TSOP T/R
|
||
SI3552DV-T1-GE3
|
VISHAY | 完全替代 | TSOP-6 |
Trans MOSFET N/P-CH 30V 2.5A/1.8A 6Pin TSOP T/R
|
||
SI3586DV-T1-GE3
|
Vishay Semiconductor | 类似代替 |
MOSFET N/P-CH 20V 2.9A 6-TSOP
|
|||
|
|
Vishay Intertechnology | 类似代替 | TSOP-6 |
Trans MOSFET N/P-CH 20V 2.5A/0.57A 6Pin TSOP T/R
|
||
SI3588DV-T1-E3
|
VISHAY | 类似代替 | TSOP-6 |
Trans MOSFET N/P-CH 20V 2.5A/0.57A 6Pin TSOP T/R
|
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