Technical parameters/Input voltage (DC): | 1.50 V |
|
Technical parameters/output current: | 25 mA |
|
Technical parameters/dissipated power: | 210 mW |
|
Technical parameters/data rate: | 5.00 Mbps |
|
Technical parameters/rise time: | 30 ns |
|
Technical parameters/isolation voltage: | 3750 Vrms |
|
Technical parameters/descent time: | 7 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
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Encapsulation parameters/installation method: | Through Hole |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
|
Dimensions/Length: | 5.08 mm |
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Dimensions/Width: | 3.94 mm |
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Dimensions/Height: | 3.17 mm |
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Dimensions/Packaging: | SOIC-8 |
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Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
HP | 功能相似 |
高速光耦合器 5MBd 1Ch 1.6mA
|
|||
HCNW2201
|
Broadcom | 功能相似 | DIP-8 |
高速光耦合器 5MBd 1Ch 1.6mA
|
||
HCPL-0211
|
AVAGO Technologies | 类似代替 | SOIC-8 |
高速光耦合器 5MBd 1Ch 1.6mA
|
||
HCPL-0211
|
HP | 类似代替 |
高速光耦合器 5MBd 1Ch 1.6mA
|
|||
HCPL-0211-060E
|
AVAGO Technologies | 类似代替 | SOIC-8 |
高速光耦合器 5MBd 1Ch 1.6mA
|
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