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Model KSD1616AYTA

Description NPN 晶体管，60V 至 100V，Fairchild Semiconductor ### 双极晶体管，Fairchild Semiconductor 双极性结点晶体管 (BJT) 板系列提供完整的解决方案，用于满足各种电路应用需求。创新的封装设计用于提供最小尺寸、最高可靠性和最大热性能。

Brand: Fairchild

Packaging TO-92-3

Delivery time

Packaging method Tape

Standard packaging quantity 1

Freight charges： In stock Freight rate：$13.00

Quantity：

Inventory(5172) Minimum order quantity(1)

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Technical parameters/frequency:	160 MHz
Technical parameters/rated voltage (DC):	60.0 V
Technical parameters/rated current:	1.00 A
Technical parameters/polarity:	NPN
Technical parameters/dissipated power:	750 mW
Technical parameters/breakdown voltage (collector emitter):	60 V
Technical parameters/Maximum allowable collector current:	1A
Technical parameters/minimum current amplification factor (hFE):	135
Technical parameters/maximum current amplification factor (hFE):	600
Technical parameters/rated power (Max):	750 mW
Technical parameters/operating temperature (Max):	150 ℃
Technical parameters/operating temperature (Min):	-55 ℃
Technical parameters/dissipated power (Max):	750 mW
Encapsulation parameters/installation method:	Through Hole
Package parameters/number of pins:	3
Encapsulation parameters/Encapsulation:	TO-92-3
Dimensions/Length:	5.2 mm
Dimensions/Width:	3.93 mm
Dimensions/Height:	5.33 mm
Dimensions/Packaging:	TO-92-3
Physical parameters/materials:	Silicon
Physical parameters/operating temperature:	150℃ (TJ)
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Tape
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free
Customs information/ECCN code:	EAR99

Alternative material

	Model	Brand	Similarity	Encapsulation	Introduction	Data manual
	KSD1616AYTA	Fairchild	功能相似	TO-92-3	NPN 晶体管，60V 至 100V，Fairchild Semiconductor ### 双极晶体管，Fairchild Semiconductor 双极性结点晶体管 (BJT) 板系列提供完整的解决方案，用于满足各种电路应用需求。创新的封装设计用于提供最小尺寸、最高可靠性和最大热性能。	PDF
	KSD1616AYTA	ON Semiconductor	功能相似	TO-226-3	NPN 晶体管，60V 至 100V，Fairchild Semiconductor ### 双极晶体管，Fairchild Semiconductor 双极性结点晶体管 (BJT) 板系列提供完整的解决方案，用于满足各种电路应用需求。创新的封装设计用于提供最小尺寸、最高可靠性和最大热性能。	PDF