C1206X330JDGACTU In Stock|PDF|Datasheet|Price|Agent[C1206X330JDGACTU Alternative|Silk Screen|Technology|Solution Development]-ICGOODFIND

Warm reminder: The pictures are for reference only. The actual product may vary

Model C1206X330JDGACTU

Description Kemet 1206 FT-CAP SMT MLCC 陶瓷电容器 1206 尺寸 FT-CAP SMT MLCC 陶瓷电容器可通过使用柔性端接系统提供高达 5mm 的柔性性能，这一系统可最大程度减少到组件主体的板柔性应力。这些 FT-CAP MLCC SMT 陶瓷电容器在端接系统的基座金属和镍挡板层之间具有柔韧且导电的银环氧，端接系统可以抑制到陶瓷主体的板应力传输，从而减少可导致低红外线和短路故障的柔性裂纹的产生。此外，这些 FT-CAP MLCC 陶瓷电容器具有 -55 至 + 125°C 的宽工作温度范围、低 ESR 和 ESL、高热稳定性和高波纹电流能力。这些 FT-CAP MLCC 陶瓷电容器的典型应用包括电源、LCD 荧光背光镇流器、HID 照明、电信设备、工业和医疗设备/控件、LAN/WAN 接口、模拟和数字调制解调器以及汽车应用。 ### 1206 系列 C0G (NP0) 是温度补偿的最常见配方，为 EIA I 类陶瓷材料 X7R 配方称为温度稳定陶瓷，属于 EIA II 类材料 Y5V 配方为有限温度范围内的一般用途材料。这些特征使得 Y5V 非常适合去耦应用。

Brand: KEMET Corporation

Packaging 1206

Delivery time

Packaging method Cut Tape (CT)

Standard packaging quantity 1

Freight charges： In stock Freight rate：$13.00

Quantity：

Inventory(9530) Minimum order quantity(1)

Add to Cart Buy now

Welcome to use ICGOODFIND AI Assistant

Chip AI consultant

Download related files

PDF

Specification parameters
PDF
Silk screen printing
Review and share the purchase （0 ）
Product inquiry (0)
Selection Manual
Adapter model (0)

Technical parameters/rated voltage (DC):	1.00 kV
Technical parameters/Insulation resistance:	100 GΩ
Technical parameters/capacitance:	33 pF
Technical parameters/tolerances:	±5 %
Technical parameters/dielectric properties:	C0G/NP0
Technical parameters/operating temperature (Max):	125 ℃
Technical parameters/operating temperature (Min):	-55 ℃
Technical parameters/rated voltage:	1000 V
Encapsulation parameters/installation method:	Surface Mount
Encapsulation parameters/Encapsulation (metric):	3216
Encapsulation parameters/Encapsulation:	1206
Dimensions/Length:	3.3 mm
Dimensions/Width:	3.3 mm
Dimensions/Height:	1 mm
Dimensions/Packaging (Metric):	3216
Dimensions/Packaging:	1206
Physical parameters/medium materials:	Ceramic
Physical parameters/operating temperature:	-55℃ ~ 125℃
Physical parameters/temperature coefficient:	±15 %
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Cut Tape (CT)
Other/Manufacturing Applications:	Boardflex sensitive
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free
Compliant with the REACH SVHC standard:	No SVHC
Compliant with standard/REACH SVHC version:	2015/06/15

Alternative material

	Model	Brand	Similarity	Encapsulation	Introduction	Data manual
	MC1206N330J102CT	Multicomp	功能相似	1206	MULTICOMP MC1206N330J102CT 多层陶瓷电容器, 表面贴装, MC系列, 33 pF, ± 5%, C0G / NP0, 1 kV, 1206 [3216 公制]	PDF