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Description SMD Comm C0G Flex, Ceramic, Commercial Grade, 15 pF, 5%, 50 VDC, C0G, SMD, MLCC, FT-CAP, Ultra-Stable, 0805
Product QR code
Packaging 0805
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
0.42  yuan 0.42yuan
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(5700) Minimum order quantity(1)
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Technical parameters/capacitance:

15 pF

 

Technical parameters/operating temperature (Max):

125 ℃

 

Technical parameters/operating temperature (Min):

-55 ℃

 

Encapsulation parameters/installation method:

Surface Mount

 

Encapsulation parameters/Encapsulation:

0805

 

Dimensions/Length:

2.00 mm

 

Dimensions/Width:

1.25 mm

 

Dimensions/Height:

0.78 mm

 

Dimensions/Packaging:

0805

 

Physical parameters/operating temperature:

-55℃ ~ 125℃

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Tape & Reel (TR)

 

Other/Manufacturing Applications:

Boardflex sensitive

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
08055A150JAT2A 08055A150JAT2A AVX 类似代替 0805
AVX 08055A150JAT2A 多层陶瓷电容器, 表面贴装, 15 pF, ± 5%, C0G / NP0, 50 V, 0805 [2012 公制]
PDF
500R15N150JV4T 500R15N150JV4T Johanson Technology 类似代替 0805
0805 15pF ±5% 50V NPO
PDF
CL21C150JBANNNC CL21C150JBANNNC Samsung 类似代替 0805
Samsung 0805 C0G/X5R MLCC series reels ### 0805 系列 镍挡板终端覆镀锡 (NiSn) 层,应用包括移动电话、视频和调谐器设计,COG/NPO 是“温度补偿”的最常见配方,为 EIA I 类陶瓷材料,X7R、X5R 配方称为“温度稳定”陶瓷,属于 EIA II 类材料,Y5V、Z5U 配方适合有限温度范围内的一般用途,属于 EIA II 类材料;这些特征非常适合退耦应用。Y5V、Z5U 配方适合有限温度范围内的一般用途,属于 EIA II 类材料;这些特征非常适合退耦应用。
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