Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | BBGA-256 |
|
Dimensions/Packaging: | BBGA-256 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
Customs information/ECCN code: | 3A991 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT79RC32V334-100BBG
|
Integrated Device Technology | 功能相似 | BBGA-256 |
IC PROC 32Bit CORE 100MHz 256BGA
|
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