Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BBGA-256
External dimensions/packaging: BBGA-256
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT79RC32V334-100BBG
|
Integrated Device Technology | 功能相似 | BBGA-256 |
IC PROC 32Bit CORE 100MHz 256BGA
|
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