Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 6 |
|
Encapsulation parameters/Encapsulation: | TSSOP-6 |
|
Dimensions/Packaging: | TSSOP-6 |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BGA2717
|
NXP | 功能相似 | TSSOP |
MMIC宽带放大器器 MMIC wideband amplifier
|
||
BGA2717,115
|
NXP | 功能相似 | SOT-323-6 |
RF Amp Chip Single GP 6V 6Pin SC-88 T/R
|
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