Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 6
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AVT-52663-TR1G
|
AVAGO Technologies | 功能相似 | TSSOP-6 |
BROADCOM LIMITED AVT-52663-TR1G 射频芯片, 增益放大器, InGaP, HBT, 6SOT363
|
||
BGA2717
|
NXP | 功能相似 | TSSOP |
MMIC宽带放大器器 MMIC wideband amplifier
|
||
UPC3215TB-E3
|
NEC | 功能相似 |
100MHz - 2900MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, MINI, PLASTIC, SO-6
|
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