Technical parameters/Contact electroplating: | Gold |
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Encapsulation parameters/installation method: | Through Hole |
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Dimensions/Length: | 13.48 mm |
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Physical parameters/contact material: | Beryllium Copper |
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Physical parameters/insulation material: | Teflon |
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Physical parameters/shell material: | Brass |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
132225
|
Amphenol | 类似代替 | Through Hole |
Conn SMA RCP 0Hz to 18GHz 50Ω Solder RA Thru-Hole Gold
|
||
85_SMA-50-0-144/111_YH
|
Huber & Suhner | 类似代替 |
HUBER & SUHNER 85_SMA-50-0-144/111_YH 射频/同轴连接器, SMA同轴, 直角插座, 通孔安装 直角, 50 ohm, 铍铜
|
|||
85_SMA-50-0-144/111_YH
|
Suhner | 类似代替 |
HUBER & SUHNER 85_SMA-50-0-144/111_YH 射频/同轴连接器, SMA同轴, 直角插座, 通孔安装 直角, 50 ohm, 铍铜
|
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