Technical parameters/Contact electroplating: Gold
Technical parameters/operating temperature (Max): 165 ℃
Technical parameters/operating temperature (Min): -65 ℃
Encapsulation parameters/installation method: Through Hole
Physical parameters/contact material: Beryllium Copper
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: RF Communications, Industrial, RF Communications, Industrial
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1052987-1
|
TE Connectivity | 功能相似 |
AMP FROM TE CONNECTIVITY 1052987-1 射频/同轴连接器, SMA
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142-0701-501
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Johnson Electric | 功能相似 |
JOHNSON 142-0701-501 射频/同轴连接器, SMA同轴, 直角隔板安装插座, 焊接, 50 ohm, 铍铜
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142-0701-501
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Cinch Connectivity Solutions | 功能相似 | SMA |
JOHNSON 142-0701-501 射频/同轴连接器, SMA同轴, 直角隔板安装插座, 焊接, 50 ohm, 铍铜
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142-0701-551
|
Cinch Connectivity Solutions | 类似代替 | Through Hole |
射频/同轴连接器, SMA同轴, 直角隔板安装插座, 通孔安装 直角, 50 ohm, 铍铜
|
||
142-0701-551
|
Johnson Electric | 类似代替 |
射频/同轴连接器, SMA同轴, 直角隔板安装插座, 通孔安装 直角, 50 ohm, 铍铜
|
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