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Model 1206Y1K00102KXT
Description Syfer Flexicap 1206 由于听到客户 MLCC 遇到应力损坏的经历，开发了 FlexiCap™ 专有柔性环氧聚合体端接材料，应用于常见镍挡板表面下面的设备 FlexiCap™ 将承受比传统电容器更大的板弯曲度 FlexiCap™ 的另外一个优点是 MLCC 可耐温度循环 -55ºC 至 125ºC 超过 1000 次而不会破裂 可使用您的传统波峰焊或回流焊接技术焊接 FlexiCap™，无需调整到设备或当前工艺
Product QR code
Brand: Syfer Technology
Packaging 1206
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
0.71  yuan 0.71yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(2342) Minimum order quantity(1)
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Technical parameters/capacitance:

1 nF

 

Technical parameters/tolerances:

±10 %

 

Technical parameters/operating temperature (Max):

125 ℃

 

Technical parameters/operating temperature (Min):

-55 ℃

 

Encapsulation parameters/installation method:

Surface Mount

 

Encapsulation parameters/Encapsulation (metric):

3216

 

Encapsulation parameters/Encapsulation:

1206

 

Dimensions/Length:

3.2 mm

 

Dimensions/Width:

1.6 mm

 

Dimensions/Height:

1.6 mm

 

Dimensions/Packaging (Metric):

3216

 

Dimensions/Packaging:

1206

 

Physical parameters/temperature coefficient:

±15 %

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Tape & Reel (TR)

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
1206J1K00102KXT 1206J1K00102KXT Syfer Technology 类似代替 1206
Syfer MLCC 1206 适用于所有通用和高可靠性应用 全部使用 Syfer 的独特湿处理制成并包含贵金属电极 ### 1206 系列 C0G (NP0) 是“温度补偿”的最常见配方，为 EIA I 类陶瓷材料 X7R 配方称为“温度稳定”陶瓷，属于 EIA II 类材料 Y5V 配方为有限温度范围内的一般用途材料。这些特征使得 Y5V 非常适合去耦应用。
PDF
1206J1K00102KXT 1206J1K00102KXT Knowles Corporation 类似代替 1206
Syfer MLCC 1206 适用于所有通用和高可靠性应用 全部使用 Syfer 的独特湿处理制成并包含贵金属电极 ### 1206 系列 C0G (NP0) 是“温度补偿”的最常见配方，为 EIA I 类陶瓷材料 X7R 配方称为“温度稳定”陶瓷，属于 EIA II 类材料 Y5V 配方为有限温度范围内的一般用途材料。这些特征使得 Y5V 非常适合去耦应用。
PDF
CC1206KKX7RCBB102 CC1206KKX7RCBB102 Yageo 功能相似 1206
1206 0.001 uF 1 kV 10 % 容差 X7R SMD 陶瓷电容
PDF
CL31B102KIFNNNE CL31B102KIFNNNE Samsung 类似代替 1206
CL31 系列 1 nF 1 kV ±10 % 容差 X7R 表面贴装 多层陶瓷电容
PDF

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