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Description TE connectivity AMPMODU 50/50 1.27mm x 1.27mm 栅格板对板垂直插座 AMPMODU 50/50 1.27mm x 1.27mm 栅格板对板垂直插座,用于高密度 .050 x .050 应用中的 SMT 平行板对板堆叠。 平行板对板堆叠高度为 6.35mm,可通过使用相同插座和选择合适的管座(板对板 .050 x.050 双排垂直和直角管座)来达到 8.13mm 和 9.91mm。 这些 AMPMODU 50/50 1.27mm x 1.27mm 垂直 SMT 板对板插座连接器具有 UL 94V-0 黑色玻璃填充热塑性外壳、印刷电路板压制接线柱、极化插片、镀金触点且与 IR(红外)和 VPR(汽相回流)表面安装工艺兼容。 ### 认可 UL 94V-0 ### TE Connectivity AMPMODU 50/50 1.27mm 连接器 TE Connectivity Modu 50/50 是高密度 1.27mm 栅格电路板到电路板连接系统,用于 SMT 装配。 印刷电路板管座的三个不同高度的选择允许获得多用途堆叠解决方案。
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Packaging Surface Mount
Delivery time
Packaging method Tube
Standard packaging quantity 1
105.33  yuan 105.33yuan
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(5603) Minimum order quantity(1)
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Alternative material

技术参数/触点数:

100

 

技术参数/极性:

Female

 

技术参数/触点电镀:

Gold, Tin over Nickel

 

技术参数/额定电压(DC):

30.0 V

 

技术参数/额定电压(AC):

30.0 V

 

技术参数/额定电流:

4 A

 

技术参数/绝缘电阻:

5000 MΩ

 

技术参数/排数:

2

 

技术参数/方向:

Vertical

 

技术参数/易燃性等级:

UL 94 V-0

 

技术参数/针脚数:

100

 

技术参数/额定电流(Max):

0.5A/触头

 

技术参数/工作温度(Max):

105 ℃

 

技术参数/工作温度(Min):

-65 ℃

 

技术参数/额定电压(Max):

30 VAC

 

技术参数/额定电压:

30 VAC

 

技术参数/接触电阻(Max):

16 mΩ

 

封装参数/安装方式:

Surface Mount

 

封装参数/引脚间距:

1.27 mm

 

外形尺寸/长度:

67.97 mm

 

外形尺寸/宽度:

3.05 mm

 

外形尺寸/高度:

4.83 mm

 

外形尺寸/引脚间距:

1.27 mm

 

物理参数/外壳颜色:

Black

 

物理参数/颜色:

Black

 

物理参数/触点材质:

Copper Alloy

 

物理参数/绝缘材质:

Thermoplastic

 

物理参数/工作温度:

-65℃ ~ 105℃

 

物理参数/外壳材质:

Thermoplastic

 

其他/产品生命周期:

Active

 

其他/包装方式:

Tube

 

其他/制造应用:

-

 

符合标准/RoHS标准:

RoHS Compliant

 

符合标准/含铅标准:

Lead Free

 

符合标准/ELV标准:

Compliant

 

符合标准/REACH SVHC标准:

No SVHC

 

符合标准/REACH SVHC版本:

2015/06/15

 

海关信息/ECCN代码:

EAR99

 

海关信息/HTS代码:

8536694040

 

Model Brand Similarity Encapsulation Introduction Data manual
1-104652-0 1-104652-0 TE Connectivity 功能相似
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