Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | MicroSMD-16 |
|
Dimensions/Packaging: | MicroSMD-16 |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMV1090TL/NOPB
|
National Semiconductor | 完全替代 | MicroSMD-16 |
传声器前置放大器 Far Field Noise Reduction Amp
|
||
LMV1090TL/NOPB
|
TI | 完全替代 | uSMD-16 |
传声器前置放大器 Far Field Noise Reduction Amp
|
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