Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | MicroSMD-16 |
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Dimensions/Packaging: | MicroSMD-16 |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
National Semiconductor | 功能相似 | FBGA |
音频功率放大器 LMV1090TL DSBGA-30(2.1x2.5)
|
||
LMV1090TLX/NOPB
|
National Semiconductor | 完全替代 | MicroSMD-16 |
传声器前置放大器 Dual Input, Far Field Noise Suppression Microphone Amplifier 16-DSBGA -40 to 85
|
||
LMV1090TLX/NOPB
|
TI | 完全替代 | DSBGA-16 |
传声器前置放大器 Dual Input, Far Field Noise Suppression Microphone Amplifier 16-DSBGA -40 to 85
|
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