Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 48 |
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Encapsulation parameters/Encapsulation: | TFBGA |
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Dimensions/Packaging: | TFBGA |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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ST Microelectronics | 功能相似 | TFBGA |
64兆位( 4Mbx16 ,引导块) 3V供应闪存 64 Mbit (4Mbx16, Boot Block) 3V Supply Flash memory
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