Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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ST Microelectronics | 功能相似 | TFBGA |
64兆位( 4Mbx16 ,引导块) 3V供应闪存 64 Mbit (4Mbx16, Boot Block) 3V Supply Flash memory
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