Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Freescale | 完全替代 | SOIC |
ON SEMICONDUCTOR MC100EL32DG DIVIDER, DIVIDE BY 2, SOIC-8 新
|
||
|
|
Motorola | 完全替代 |
ON SEMICONDUCTOR MC100EL32DG DIVIDER, DIVIDE BY 2, SOIC-8 新
|
|||
MC100EL32DG
|
ON Semiconductor | 完全替代 | SOIC-8 |
ON SEMICONDUCTOR MC100EL32DG DIVIDER, DIVIDE BY 2, SOIC-8 新
|
||
|
|
NXP | 完全替代 | SOIC |
ON SEMICONDUCTOR MC100EL32DG DIVIDER, DIVIDE BY 2, SOIC-8 新
|
||
|
|
NXP | 完全替代 | SOIC |
评估板手册高频SOIC 8 Evaluation Board Manual for High Frequency SOIC 8
|
||
MC100EP32D
|
ON Semiconductor | 完全替代 | SOIC |
评估板手册高频SOIC 8 Evaluation Board Manual for High Frequency SOIC 8
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review