Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Freescale | 完全替代 | SOIC |
5V ECL ± 2分频器 5V ECL ±2 Divider
|
||
|
|
NXP | 完全替代 | SOIC |
5V ECL ± 2分频器 5V ECL ±2 Divider
|
||
MC100EL32DR2G
|
ON Semiconductor | 完全替代 | SOIC-8 |
5V ECL ± 2分频器 5V ECL ±2 Divider
|
||
MC100EL32DTR2G
|
ON Semiconductor | 完全替代 | TSSOP-8 |
5V ECL ± 2分频器 5V ECL ±2 Divider
|
||
|
|
Freescale | 完全替代 | TSSOP |
5V ECL ± 2分频器 5V ECL ±2 Divider
|
||
|
|
NXP | 完全替代 | TSSOP |
5V ECL ± 2分频器 5V ECL ±2 Divider
|
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