Technical parameters/power supply voltage (DC): | 3.30 V |
|
Technical parameters/halogen-free state: | Halogen Free |
|
Technical parameters/kernel architecture: | PowerPC |
|
Technical parameters/operating temperature (Max): | 95 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 357 |
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Encapsulation parameters/Encapsulation: | BBGA-357 |
|
Dimensions/Packaging: | BBGA-357 |
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Physical parameters/operating temperature: | 0℃ ~ 95℃ (TA) |
|
Other/Product Lifecycle: | Not Recommended for New Designs |
|
Other/Packaging Methods: | Tape |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC855TZQ50D4
|
NXP | 类似代替 | BGA-357 |
NXP MPC855TZQ50D4 芯片, 微处理器, 32位, 50MHZ, BGA-357
|
||
MPC855TZQ50D4
|
Freescale | 类似代替 | BGA-357 |
NXP MPC855TZQ50D4 芯片, 微处理器, 32位, 50MHZ, BGA-357
|
||
|
|
Motorola | 类似代替 | BGA |
NXP MPC860ENZQ50D4 Microprocessor, PowerQUICC I Series, 50MHz, 32Bit, 8KB, 3.135V to 3.465V, BGA-357
|
||
MPC860ENZQ50D4
|
NXP | 类似代替 | BGA-357 |
NXP MPC860ENZQ50D4 Microprocessor, PowerQUICC I Series, 50MHz, 32Bit, 8KB, 3.135V to 3.465V, BGA-357
|
||
MPC860TVR50D4
|
Freescale | 类似代替 | BGA-357 |
微处理器 - MPU POWER QUICC-NO LEAD
|
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