Technical parameters/operating temperature (Max): | 95 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Technical parameters/power supply voltage (Max): | 3.465 V |
|
Technical parameters/power supply voltage (Min): | 3.135 V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 357 |
|
Encapsulation parameters/Encapsulation: | BGA |
|
Dimensions/Packaging: | BGA |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Each |
|
Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | Lead Free |
|
Compliant with standard/REACH SVHC version: | 2014/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Motorola | 完全替代 | 357 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 50MHz 357Pin BGA T/R
|
||
MPC860ENZQ50D4R2
|
Freescale | 完全替代 | PBGA-357 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 50MHz 357Pin BGA T/R
|
||
MPC860TZQ50D4
|
NXP | 完全替代 | PBGA-357 |
微处理器 - MPU POWER QUICC
|
||
MPC860TZQ50D4R2
|
Freescale | 完全替代 | PBGA-357 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 50MHz 357Pin BGA T/R
|
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