Technical parameters/forward voltage: | 0.6 V |
|
Technical parameters/thermal resistance: | 635℃/W (RθJA) |
|
Technical parameters/forward current: | 200 mA |
|
Technical parameters/forward voltage (Max): | 600 mV |
|
Technical parameters/forward current (Max): | 200 mA |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Technical parameters/dissipated power (Max): | 200 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 2 |
|
Encapsulation parameters/Encapsulation: | SOD-523-2 |
|
Dimensions/Length: | 1.3 mm |
|
Dimensions/Width: | 0.9 mm |
|
Dimensions/Height: | 0.7 mm |
|
Dimensions/Packaging: | SOD-523-2 |
|
Physical parameters/operating temperature: | -55℃ ~ 150℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1PS79SB31,115
|
Nexperia | 功能相似 | SOD-523-2 |
200mA 至 500mA,NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
|
||
PMEG3010EB,115
|
Nexperia | 功能相似 | SOD-523 |
NXP PMEG3010EB,115 肖特基整流器, 单, 30 V, 1 A, SOD-523, 2 引脚, 680 mV
|
||
PMEG3010EB,115
|
NXP | 功能相似 | SOD-523 |
NXP PMEG3010EB,115 肖特基整流器, 单, 30 V, 1 A, SOD-523, 2 引脚, 680 mV
|
||
RB520S-30TE61
|
ROHM Semiconductor | 功能相似 | SOD-523 |
ROHM RB520S-30TE61 小信号肖特基二极管, 单, 30 V, 200 mA, 600 mV, 1 A, 125 °C
|
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