Technical parameters/minimum current amplification factor (hFE): | 230 |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Technical parameters/dissipated power (Max): | 570 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 3 |
|
Encapsulation parameters/Encapsulation: | SOT-23 |
|
Dimensions/Length: | 3 mm |
|
Dimensions/Width: | 1.4 mm |
|
Dimensions/Height: | 1.1 mm |
|
Dimensions/Packaging: | SOT-23 |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PBRP123ET,215
|
NXP | 功能相似 | SOT-23-3 |
TO-236AB PNP 40V 600mA
|
||
PBRP123ET,215
|
Nexperia | 功能相似 | SOT-23-3 |
TO-236AB PNP 40V 600mA
|
||
PBRP123YT,215
|
Nexperia | 功能相似 | SOT-23-3 |
晶体管 双极预偏置/数字, 单路PNP, -40 V, -800 mA, 2.2 kohm, 10 kohm
|
||
PBRP123YT,215
|
NXP | 功能相似 | SOT-23-3 |
晶体管 双极预偏置/数字, 单路PNP, -40 V, -800 mA, 2.2 kohm, 10 kohm
|
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