Technical parameters/rated power: | 1.4 W |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 0.73 W |
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Technical parameters/gain bandwidth product: | 130 MHz |
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Technical parameters/breakdown voltage (collector emitter): | 60 V |
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Technical parameters/minimum current amplification factor (hFE): | 300 |
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Technical parameters/rated power (Max): | 2.3 W |
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Technical parameters/DC current gain (hFE): | 300 |
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Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/dissipated power (Max): | 2300 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOT-96-1 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Height: | 1.75 mm |
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Dimensions/Packaging: | SOT-96-1 |
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Physical parameters/operating temperature: | 150℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Motor drive and control, power management, industrial |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | lead-free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PBSS4041SPN
|
NXP | 功能相似 | SOIC |
NXP PBSS4041SPN 双极晶体管阵列, NPN, PNP, 60 V, 2.3 W, 6.7 A, 300 hFE, SOIC
|
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