Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PCF8570P
|
NXP | 功能相似 | DIP |
SRAM Chip Sync Single 3.3V/5V 2Kbit 256 x 8 3.4us 8Pin PDIP
|
||
|
|
Philips | 功能相似 | DIP |
SRAM Chip Sync Single 3.3V/5V 2Kbit 256 x 8 3.4us 8Pin PDIP
|
||
|
|
NXP | 功能相似 | DIP |
IC 256 X 8 STANDARD SRAM, PDIP8, Static RAM
|
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