Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 272 |
|
Encapsulation parameters/Encapsulation: | PBGA |
|
Dimensions/Packaging: | PBGA |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PCI9656-BA66BI G
|
Broadcom | 完全替代 | BGA-272 |
PCI与PCIe器件, I/O加速器, PCI 2.2, 2.3V至2.7V电源, BGA-272
|
||
|
|
AVAGO Technologies | 完全替代 | PBGA-272 |
PCI与PCIe器件, I/O加速器, PCI 2.2, 2.3V至2.7V电源, BGA-272
|
||
|
|
Broadcom | 功能相似 | BGA |
PCI Bus Controller, CMOS, PBGA272, 27 X 27MM, 1.27MM PITCH, LEAD FREE, PLASTIC, BGA-272
|
||
PCI9656-BA66BIG
|
PLX | 功能相似 | BGA |
PCI Bus Controller, CMOS, PBGA272, 27 X 27MM, 1.27MM PITCH, LEAD FREE, PLASTIC, BGA-272
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review