Technical parameters/number of pins: | 272 |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 3.3V, 5V |
|
Technical parameters/power supply voltage (Max): | 2.7 V |
|
Technical parameters/power supply voltage (Min): | 2.3 V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 272 |
|
Encapsulation parameters/Encapsulation: | BGA-272 |
|
Dimensions/Height: | 1.27 mm |
|
Dimensions/Packaging: | BGA-272 |
|
Other/Product Lifecycle: | Unknown |
|
Other/Manufacturing Applications: | - |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PCI9656-BA66BI
|
Broadcom | 完全替代 | BGA-272 |
PCI Bus Mastering I/O Accelerator 272Pin BGA
|
||
|
|
AVAGO Technologies | 完全替代 | PBGA |
PCI Bus Mastering I/O Accelerator 272Pin BGA
|
||
PCI9656-BA66BI
|
PLX | 完全替代 | PBGA-282 |
PCI Bus Mastering I/O Accelerator 272Pin BGA
|
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