Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 20 |
|
Encapsulation parameters/Encapsulation: | QFN |
|
Dimensions/Packaging: | QFN |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC18LF13K50-I/MQ
|
Micrel | 功能相似 | QFN-20 |
20针USB闪存微控制器采用纳瓦XLP技术 20-Pin USB Flash Microcontrollers with nanoWatt XLP Technology
|
||
PIC18LF13K50-I/MQ
|
Microchip | 功能相似 | QFN-20 |
20针USB闪存微控制器采用纳瓦XLP技术 20-Pin USB Flash Microcontrollers with nanoWatt XLP Technology
|
||
PIC18LF13K50T-I/MQ
|
Microchip | 功能相似 | QFN |
20针USB闪存微控制器采用纳瓦XLP技术 20-Pin USB Flash Microcontrollers with nanoWatt XLP Technology
|
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