Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 20 |
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Encapsulation parameters/Encapsulation: | QFN |
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Dimensions/Packaging: | QFN |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC18F13K50-I/SO
|
Microchip | 功能相似 | SOIC-20 |
MICROCHIP PIC18F13K50-I/SO 微控制器, 8位, 闪存, PIC18FxxKxx, 48 MHz, 8 KB, 512 Byte, 20 引脚, SOIC
|
||
PIC18F13K50T-I/MQ
|
Microchip | 功能相似 | QFN |
20针USB闪存微控制器采用纳瓦XLP技术 20-Pin USB Flash Microcontrollers with nanoWatt XLP Technology
|
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