Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | TO-39 |
|
Dimensions/Packaging: | TO-39 |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2N1711
|
Central Semiconductor | 功能相似 | TO-39-3 |
MULTICOMP 2N1711 单晶体管 双极, NPN, 50 V, 70 MHz, 3 W, 500 mA, 35 hFE
|
||
2N1711
|
Microsemi | 功能相似 | TO-5 |
MULTICOMP 2N1711 单晶体管 双极, NPN, 50 V, 70 MHz, 3 W, 500 mA, 35 hFE
|
||
2N1711
|
ETC | 功能相似 |
MULTICOMP 2N1711 单晶体管 双极, NPN, 50 V, 70 MHz, 3 W, 500 mA, 35 hFE
|
|||
2N1711
|
CDIL | 功能相似 |
MULTICOMP 2N1711 单晶体管 双极, NPN, 50 V, 70 MHz, 3 W, 500 mA, 35 hFE
|
|||
2N1711
|
Semelab | 功能相似 | TO-39 |
MULTICOMP 2N1711 单晶体管 双极, NPN, 50 V, 70 MHz, 3 W, 500 mA, 35 hFE
|
||
2N2218A
|
Motorola | 功能相似 | TO-39 |
MULTICOMP 2N2218A 单晶体管 双极, NPN, 40 V, 250 MHz, 800 mW, 800 mA, 20 hFE
|
||
|
|
Microsemi | 功能相似 | TO-39 |
MULTICOMP 2N2218A 单晶体管 双极, NPN, 40 V, 250 MHz, 800 mW, 800 mA, 20 hFE
|
||
2N2218A
|
Infineon | 功能相似 | TO-39 |
MULTICOMP 2N2218A 单晶体管 双极, NPN, 40 V, 250 MHz, 800 mW, 800 mA, 20 hFE
|
||
2N2218A
|
CDIL | 功能相似 |
MULTICOMP 2N2218A 单晶体管 双极, NPN, 40 V, 250 MHz, 800 mW, 800 mA, 20 hFE
|
|||
|
|
Central Semiconductor | 功能相似 | TO-39 |
TO-39 NPN 40V 0.8A
|
||
|
|
New Jersey Semiconductor | 功能相似 |
NPN METAL CAN - SATURATED SWITCH
|
|||
|
|
Semelab | 功能相似 | BCY |
NPN METAL CAN - SATURATED SWITCH
|
||
2N3724
|
Central Semiconductor | 功能相似 | TO-39 |
NPN METAL CAN - SATURATED SWITCH
|
||
2N3724
|
Fairchild | 功能相似 | TO-5 |
NPN METAL CAN - SATURATED SWITCH
|
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