Technical parameters/Insulation resistance: | 100 GΩ |
|
Technical parameters/capacitance: | 0.1 µF |
|
Encapsulation parameters/installation method: | Through Hole |
|
Packaging parameters/pin spacing: | 15 mm |
|
Dimensions/Length: | 18 mm |
|
Dimensions/Width: | 18 mm |
|
Dimensions/Height: | 16 mm |
|
Dimensions/Pin Spacing: | 15 mm |
|
Physical parameters/operating temperature: | -55℃ ~ 105℃ |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PI3
|
Diodes | 功能相似 | TSSOP |
Film Capacitor, Polyester, 630V, 5% +Tol, 5% -Tol, 0.1uF, Through Hole Mount, 7124, RADIAL LEADED
|
||
PI3
|
Catalyst | 功能相似 | DIP |
Film Capacitor, Polyester, 630V, 5% +Tol, 5% -Tol, 0.1uF, Through Hole Mount, 7124, RADIAL LEADED
|
||
R76PI31004030J
|
KEMET Corporation | 完全替代 | Radial, Box |
KEMET R76PI31004030J 膜电容, AEC-Q200 R76系列, 0.1 µF, ± 5%, PP(聚丙烯), 630 V
|
||
R76PI3100SE30J
|
KEMET Corporation | 完全替代 | Radial |
100nF ±5% 630V 10mm
|
||
|
|
Arcotronics | 完全替代 |
100nF ±5% 630V 10mm
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review