Package parameters/number of pins: | 668 |
|
Encapsulation parameters/Encapsulation: | BGA |
|
Dimensions/Packaging: | BGA |
|
Physical parameters/operating temperature: | -55℃ ~ 125℃ |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Xilinx | 功能相似 | BBGA-668 |
XC4VLX25 11FF668C 磨码
|
||
|
|
TI | 功能相似 |
XC4VLX25 11FFG668C 磨码
|
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