Encapsulation parameters/Encapsulation: | BGA |
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Dimensions/Packaging: | BGA |
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Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NAND01GW3B2BZA6F
|
ST Microelectronics | 功能相似 | TFBGA |
NAND Flash Parallel 3V/3.3V 1Gbit 128M x 8Bit 25us 63Pin VFBGA T/R
|
||
TC58NVG0S3EBAI4
|
Toshiba | 功能相似 | BGA |
Toshiba ### 快闪存储器 闪存 IC 是非易失 RAM,必须按块写入/擦除。 它有限定的写入周期的次数,适用于不经常更改的程序存储。
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