Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Obsolete |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
National Semiconductor | 功能相似 | DIP |
IC EE PLD, 20 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24, Programmable Logic Device
|
||
PAL16L8NC
|
National Semiconductor | 功能相似 | DIP |
Progammable阵列逻辑系列24 ( PAL系列24 ) Progammable Array Logic Series 24 (PAL Series 24)
|
||
|
|
National Semiconductor | 功能相似 | DIP |
Progammable阵列逻辑系列24 ( PAL系列24 ) Progammable Array Logic Series 24 (PAL Series 24)
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review