Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Obsolete |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
National Semiconductor | 功能相似 | DIP |
Progammable阵列逻辑系列24 ( PAL系列24 ) Progammable Array Logic Series 24 (PAL Series 24)
|
||
PAL22V10Z-25CJTL
|
TI | 功能相似 | CDIP-24 |
EPICE CMOS可编程阵列逻辑电路 EPICE CMOS PROGRAMMABLE ARRAY LOGIC CIRCUITS
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review